Interlayer chip cooling apparatus

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United States of America Patent

PATENT NO 9875953
SERIAL NO

14744944

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Abstract

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An integrated circuit (IC) can be cooled by using a structure that includes two elements, such as integrated circuits (ICs) or electronic packages, in a stacked arrangement, with the elements having surfaces that face each other. The structure also includes a pair of fluidic channel boundaries, between the facing surfaces, where each fluidic channel boundary is formed by an arrangement of adjacent discrete connecting structures. The primary and secondary fluidic channel boundaries and the facing surfaces define a fluidic channel that is useful for promoting boiling of and directing the flow of a refrigerant between the two surfaces.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chainer, Timothy J Putnam Valley, US 129 2360
Parida, Pritish R Fishkill, US 69 748
Schultz, Mark D Ossining, US 97 966

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