Interconnect structure with air-gaps

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9875967
SERIAL NO

15464759

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The present disclosure relates to an interconnect structure. In some embodiments, the interconnect structure has a first conductive body arranged within a first dielectric layer over a substrate. A first air-gap separates sidewalls of the first conductive body from the first dielectric layer. A barrier layer is arranged on sidewalls of the first conductive body at a location between the first conductive body and the first air-gap. The first air-gap is defined by a sidewall of the barrier layer and an opposing sidewall of the first dielectric layer.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chuang, Cheng-Chi New Taipei, TW 228 246
Lin, Tien-Lu Hsinchu, TW 101 241
Wang, Yung-Chih Taoyuan, TW 62 215
Yang, Tai-I Hsinchu, TW 88 260

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jul 23, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jul 23, 2029
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00