Conductive external connector structure and method of forming

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9875979
SERIAL NO

14942226

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Chien-Pin Pingzhen, TW 8 37
Chen, Wen-Ming Zhunan Township, TW 33 144
Cheng, Yung-Chiuan Kaohsiung, TW 4 4
Hsu, Yu-Nu Tainan, TW 11 30
Huang, Cheng-Lin Hsin-Chu, TW 115 1260
Huang, Chien-Ming Hsin-Chu, TW 75 521
Huang, Wei-Chih Taipei, TW 34 33
Ku, Chin-Yu Hsin-Chu, TW 61 117
Lin, Chi-Hung Kaohsiung, TW 87 682
Liu, Chen-Hsun Tainan, TW 9 18
Liu, Yuan-Fu Kaohsiung, TW 4 4
Lo, Chun-Yen Hsin-Chu, TW 14 69
Pang, Te-Hsun Tainan, TW 13 26
Shih, Meng-Fu Hsin-Chu, TW 14 111

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jul 23, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jul 23, 2029
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00