Flip-chip bonder with induction coils and a heating element

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United States of America Patent

PATENT NO 9875985
SERIAL NO

14543950

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Abstract

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A method and apparatus for flip chip bonding using conductive and inductive heating to heat a plurality of solder bumps located between a chip carrier and a chip.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nah, Jae-woong Closter, US 154 1159
Quesnel, Sébastien S Granby, CA 1 3
Sakuma, Katsuyuki Fishkill, US 86 310

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