Miniature wafer-level camera modules
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United States of America Patent
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Jan 23, 2018
Issued Date -
N/A
app pub date -
Dec 15, 2015
filing date -
Mar 25, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
In one aspect, a method includes providing a lens substrate having an array of lenses. The lens substrate includes an overflow region next to each lens of the array. Each overflow region includes an overflow lens material. The method also includes separating the lens substrate into a plurality of smaller lens substrates. Each of the smaller lens substrates has one of the single lens and the plurality of stacked lenses. Separating the lens substrate into the smaller lens substrates may include removing or substantially removing the overflow regions. In one aspect, the method may be performed as a method of making a miniature camera module. Other methods are also described, as are miniature camera modules.
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