Method for fabricating ultra-low density three-dimensional thin film structure based on photo-lithography
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United States of America Patent
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Jan 30, 2018
Grant Date -
Oct 29, 2015
app pub date -
Feb 4, 2013
filing date -
Nov 29, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A method for forming an ultra-low density three-dimensional thin film structure made of a solid thin film, including: radiating ultraviolet rays of different patterns in respective predetermined directions to a liquid photosensitive resin bulk so as to harden a portion of the resin bulk; removing the liquid photosensitive resin which is not hardened so as to form a solid photosensitive resin structure; coating the surface of the solid photosensitive resin structure with a thin film; removing the thin film from the outermost surface of the resin bulk so as to expose the solid photosensitive resin; and removing the solid photosensitive resin structure.
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International Classification(s)
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B28B:SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS, SLAG O....
- B22D:CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY ....
- G03F:PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNE....
- B29L:INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RE....
- B22C:FOUNDRY MOULDING
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