Systems for probing semiconductor wafers

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9880201
SERIAL NO

14601671

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A wafer probing system includes a plurality of contacting pins connected to a test head. The system further includes a probe card electrically connectable with the test head, where the probe card includes a circuit board having a plurality of contact pads on opposite sides of the circuit board.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

  • TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Hao Luzhou, TW 893 5238
Lin, Hung-Chih Hsinchu, TW 117 1066
Peng, Ching-Nen Hsinchu, TW 50 393
Wang, Mill-Jer Hsinchu, TW 81 550

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Jul 30, 2025
11.5 Year Payment $7400.00 $3700.00 $1850.00 Jul 30, 2029
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00