Integrated photoemission sources and scalable photoemission structures

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United States of America Patent

PATENT NO 9881762
SERIAL NO

14976083

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Abstract

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A scalable, integrated multi-level photoemitter device of tapered design and method of manufacture using conventional CMOS manufacturing techniques. The photoemitter device has a tapered multi-level structure formed in a material layer of a substrate, each level comprising a layer of photoemissive material and a connecting portion, said connecting portion for connecting to an adjacent photoemissive material layer of a next successive level. A first photoemissive material layer of a first level is of a configuration having a first length or width dimension; and each successive layer includes a photoemissive material layer of successively smaller length or width dimensions

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bonam, Ravi K Albany, US 20 37

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