Back side deposition apparatus and applications

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United States of America Patent

PATENT NO 9881788
SERIAL NO

14285544

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Abstract

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The embodiments disclosed herein pertain to methods and apparatus for depositing stress compensating layers and sacrificial layers on either the front side or back side of a substrate. In various implementations, back side deposition occurs while the wafer is in a normal front side up orientation. The front/back side deposition may be performed to reduce stress introduced through deposition on the front side of the wafer. The back side deposition may also be performed to minimize back side particle-related problems that occur during post-deposition processing such as photolithography.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH CORPORATION4650 CUSHING PARKWAY FREMONT CA 94538

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chattopadhyay, Kaushik San Jose, US 14 1133
Hong, Youn Gi Pleasanton, US 6 410
Kim, Yunsang Monte Sereno, US 77 2992
Sexton, Gregory Fremont, US 13 772

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