Substrate treating apparatus and substrate treating method
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United States of America Patent
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Jan 30, 2018
Issued Date -
N/A
app pub date -
May 15, 2015
filing date -
May 26, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
An embodiment includes a substrate treating apparatus comprising: a tape supply member configured to supply a tape to be attached to a substrate; a tape collection member configured to collect a surplus tape that remains after the tape is attached to the substrate; a support member disposed between the tape supply member and the tape collection member and configured to support the substrate while the tape is attached to the substrate; and a temperature adjustment member configured to adjust a temperature of the tape that is supplied from the tape supply member to the support member.
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