Chip package and method for fabricating the same

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United States of America Patent

PATENT NO 9881889
SERIAL NO

14251470

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Abstract

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A chip package is provided, in which includes: a packaging substrate, a chip and a plurality solder balls interposed between the packaging substrate and the chip for bonding the packaging substrate and the chip, wherein the solder balls include a first portion of a first size and a second portion of a second size that is different from the first size.

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Patent Owner(s)

Patent OwnerAddress
XINTEC INC9F NO 23 JILIN RD ZHONGLI DIST TAOYUAN CITY 320

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chang, Shu-Ming New Taipei, TW 130 957
Ho, Yen-Shih Kaohsiung, TW 103 623
Huang, Yu-Lung Daxi Township, TW 46 204
Liu, Tsang-Yu Zhubei, TW 132 759

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