Wiring board and method for manufacturing the same

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9883592
APP PUB NO 20150382471A1
SERIAL NO

14846084

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate. The boundary portion has a width which is in a range of approximately 0.05 to approximately 2.0 mm.

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Patent Owner(s)

  • IBIDEN CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Furutani, Toshiki Ogaki, JP 99 887
Kato, Shinobu Ogaki, JP 54 494
Mikado, Yukinobu Ogaki, JP 44 878
Shimabe, Toyotaka Ogaki, JP 9 75

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