Manufacturing method for multi-layer circuit board having cavity
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United States of America Patent
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Jan 30, 2018
Issued Date -
N/A
app pub date -
Jan 23, 2015
filing date -
Sep 29, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A manufacturing method of a multi-layer circuit board having a cavity is provided, including the following steps: a core board is provided, and a through hole is formed penetrating the core board; two build-up structures are bonded to two opposite sides of the core board to form the multi-layer circuit board, and the two build-up structures cover the through hole; and a portion of one of the two build-up structures corresponding to the through hole is removed to make the through hole communicate with the outside and form the cavity. A multi-layer circuit board having a cavity, manufactured by the aforementioned method, is also provided.
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