Copper-based material and method for producing the same

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United States of America Patent

PATENT NO 9884467
SERIAL NO

13904950

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Abstract

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A copper-based material includes a base comprising copper and a surface treatment layer disposed on a surface of the base, the surface treatment layer including an amorphous layer containing a metal element that has a greater affinity for oxygen than for copper, oxygen, and, optionally, copper diffused from the base.

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Patent Owner(s)

Patent OwnerAddress
HITACHI METALS LTDMINATO-KU TOKYO 105-8614

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aoyama, Seigi Kita-Ibaraki, JP 44 360
Fujito, Keisuke Mito, JP 22 46
Kuroda, Hiromitsu Hitachi, JP 58 240
Sagawa, Hideyuki Tokaimura, JP 33 135
Sumi, Toru Hitachi, JP 32 226

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