White heat-curable epoxy resin composition, optical semiconductor element case made of the white heat-curable epoxy resin composition and optical semiconductor device comprised of the case
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United States of America Patent
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Feb 6, 2018
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app pub date -
Feb 16, 2016
filing date -
Feb 20, 2015
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Abstract
Provided are a white heat-curable epoxy resin composition having a high strength, high toughness and superior heat resistance; and a semiconductor device whose light receiving and other semiconductor elements are encapsulated by a cured product of such composition. The composition includes:
- (A) a prepolymer obtained by heating, melting and mixing components (A-1) triazine derivative epoxy resin, (A-2) acid anhydride and (A-3) acrylic block copolymer so as to react them at an epoxy group equivalent in the component (A-1)/acid anhydride group equivalent of the component (A-2) ratio of 0.6 to 2.0;(B) a white pigment including at least a titanium oxide;(C) an inorganic filler;(D) a curing accelerator; and(E) an antioxidant.
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