Multi-core processor using three dimensional integration

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United States of America Patent

PATENT NO 9886275
SERIAL NO

14508027

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Abstract

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Techniques for interconnects structures for a multi-core processor including at least two multi-core integrated circuits include forming at least two multi-core integrated circuits each on a respective substrate into a stack, disposing connections through the stack between a circuit of a first one of the at least two multi-core integrated circuits and a circuit of a second, different one of the at least two multi-core integrated circuits, the integrated circuits arranged in the stack with connections of the first one connected to a receiving pad of the second one.

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Patent Owner(s)

  • MELLANOX TECHNOLOGIES LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Carlson, Andrew Westborough, US 49 2122
Mattina, Matthew Boylston, US 66 1419

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