Method for manufacturing wiring board
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United States of America Patent
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Feb 6, 2018
Issued Date -
N/A
app pub date -
Jul 9, 2015
filing date -
Mar 25, 2011
priority date (Note) -
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Abstract
A method for manufacturing a wiring board includes preparing a core structure, forming on a first surface of the core structure a first buildup structure including insulation layers, and forming on a second surface of the core structure on the opposite side of the first surface of the core structure a second buildup structure including insulation layers and an inductor device. The insulation layers in the second buildup structure have thicknesses which are thinner than thicknesses of the insulation layers in the first buildup structure, and the forming of the second buildup structure includes forming the inductor device in the second buildup structure on the second surface of the core structure such that at least a portion of a conductive pattern formed in the core structure is included as a portion of the inductor device.
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