Shield film and shield printed wiring board
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United States of America Patent
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Feb 6, 2018
Issued Date -
N/A
app pub date -
Jun 5, 2013
filing date -
Jul 13, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
Provided are: a shield film having excellent shield characteristics in the high frequency region of the shield film; and a shield printed wiring board. A shield film (1) is provided on a flexible printed wiring board (8), which has a base film (5) having a signal circuit (6a) formed thereon, and an insulating film (7) that is provided on the whole upper surface of the base film (5) such that the insulating film covers the signal circuit (6a). The shield film 1 has an electroconductive adhesive layer 15 provided throughout a surface of the insulating film 7, and a metal layer 11 provided throughout a surface of the electroconductive adhesive layer 15.
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