Grain bin sensor cable forming apparatus
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Feb 13, 2018
Issued Date -
N/A
app pub date -
Jan 7, 2016
filing date -
Mar 9, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method and apparatus for forming a grain bin sensor cable including a plurality of mold members defining a mold cavity. A pre-formed cable with wires disposed therein is placed into the mold cavity, heated, and formed into a post-formed cable. The post-formed cable includes a recessed portion and a pair of end caps. Apertures are created within the recessed portion so as to expose a portion of the wires. The end caps are generally cone-shaped and include vertical walls. The post-formed cable is removed from the mold cavity and a sensor package is coupled to the wires exposed in the recessed portion and captured between the vertical walls of the end caps. A housing is coupled about the sensor package.
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