Phosphonium compound, epoxy resin composition including the same and semiconductor device prepared using the same

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United States of America Patent

PATENT NO 9890307
SERIAL NO

15209871

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Abstract

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A phosphonium compound, an epoxy resin composition including the same, a semiconductor device encapsulated with the same, and a method of encapsulating a semiconductor device, the phosphonium compound being represented by Formula 1:

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Patent Owner(s)

  • SAMSUNG SDI CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheon, Jin Min Suwon-si, KR 13 64
Choi, Jin Woo Suwon-si, KR 163 689
Chung, Joo Young Suwon-si, KR 17 16
Han, Seung Suwon-si, KR 23 23
Kim, Min Gyum Suwon-si, KR 11 12
Kwon, Ki Hyeok Suwon-si, KR 6 8
Lee, Dong Hwan Suwon-si, KR 162 855

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