Semiconductor device and method for manufacturing the same

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United States of America Patent

PATENT NO 9892985
SERIAL NO

15212718

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Abstract

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One aspect of the present disclosure provides a semiconductor device. In some embodiments, the semiconductor device includes an integrated circuit die, at least one conductive terminal disposed on the integrated circuit die, a frame positioned on the integrated circuit die, wherein the frame substantially exposes the at least one conductive terminal, and at least one conductive bump positioned in the frame, wherein the at least one conductive bump electrically connects the at least one conductive terminal.

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First Claim

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Patent Owner(s)

  • NANYA TECHNOLOGY CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Po Chun Changhua, TW 21 52

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