Semiconductor package lid thermal interface material standoffs
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United States of America Patent
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Feb 13, 2018
Issued Date -
N/A
app pub date -
Jul 24, 2014
filing date -
Jul 24, 2014
priority date (Note) -
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Abstract
Semiconductor package lid thermal interface material standoffs are disclosed and may include a substrate, a semiconductor die bonded to the substrate, a package lid bonded to the substrate and the semiconductor die thermal interface material in contact the semiconductor die, and standoffs that define a distance between the package lid and the substrate. The package lid may comprise thermal conducting material. The standoff may be within a portion of the thermal interface material. The package lid may provide a hermetic seal with the substrate. A passive device may be bonded to the substrate and covered by the package lid. A standoffs may also be formed on portions of the lid that are not in contact with the substrate. The standoff may be formed on four edges of the package lid. The standoff may comprise structures pressed into the lid.
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