Stacked package structure and manufacturing method thereof

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United States of America Patent

PATENT NO 9893035
SERIAL NO

15345490

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Importance

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Abstract

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A stacked package structure includes a first package structure having a first surface and a second surface opposite to the first surface. The first package structure includes a least one first die having a first active region disposed at a bottom of the first die; a first redistribution layer disposed on the top surface of the first die; and a plurality of first bumps disposed on the bottom surface of the first active region.

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Patent Owner(s)

  • NANYA TECHNOLOGY CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Po-Chun Changhua County, TW 71 106

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