Insulating substrates including through holes

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United States of America Patent

PATENT NO 9894763
SERIAL NO

14827456

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Abstract

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It is provided an insulating substrate including through holes 2 for conductors arranged in the insulating substrate. A thickness of the insulating substrate is 25 to 300 μm , and a diameter of the through hole is 20 to 100 μm . The insulating substrate is composed of an alumina sintered body. A relative density and an average grain size of the alumina sintered body is 99.5 percent or higher and 2 to 50 μm , respectively.

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Patent Owner(s)

  • NGK INSULATORS, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ide, Akiyoshi Kasugai, JP 54 530
Iwasaki, Yasunori Kitanagoya, JP 46 387
Miyazawa, Sugio Kasugai, JP 35 108
Nakanishi, Hirokazu Nagoya, JP 28 121
Takagaki, Tatsuro Nagoya, JP 22 28

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