Ultraviolet ray emitting package having resin adhesive layer and ultraviolet ray irradiating apparatus

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United States of America Patent

PATENT NO 9895459
SERIAL NO

15291375

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Abstract

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An ultraviolet ray emitting package includes: a substrate having an upper portion defining a recess; an ultraviolet ray emitting element provided within the recess of the substrate; an ultraviolet ray transmitting window member provided on the upper portion of the substrate to cover the recess of the substrate; a resin adhesive layer provided between the upper portion of the substrate and the ultraviolet ray transmitting window member; and an optical shielding layer provided between the resin adhesive layer and the ultraviolet ray transmitting window member.

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Patent Owner(s)

Patent OwnerAddress
STANLEY ELECTRIC CO LTDMEGURO-KU TOKYO 153-8636

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kato, Hiroyuki Kanagawa, JP 407 3482
Matsuda, Junji Kanagawa, JP 12 101
Ohkubo, Tsutomu Tokyo, JP 23 139
Taniguchi, Kazuyoshi Kanagawa, JP 6 52

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