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Abstract

A polycrystalline diamond composite compact element comprises a body of polycrystalline diamond material and a cemented carbide substrate bonded to the body of polycrystalline material. The cemented carbide substrate has tungsten carbide particles bonded together by a binder material comprising an alloy of Co, Ni and Cr. The tungsten carbide particles form between 70 weight percent and 95 weight percent of the substrate. The binder material comprises between about 10 to 50 wt. % Ni, between about 0.1 to 10 wt. % Cr, and the remainder weight percent comprising Co. The size distribution of the tungsten carbide particles in the substrate has fewer than 17 percent of the carbide particles with a grain size of equal to or less than about 0.3 microns, between about 20 to 28 percent of the tungsten carbide particles having a grain size of between about 0.3 to 0.5 microns; between about 42 to 56 percent of the tungsten carbide particles having a grain size of between about 0.5 to 1 microns; less than about 12 percent of the tungsten carbide particles being greater than 1 micron; and the mean grain size of the tungsten carbide particles is about 0.6+0.2 microns.

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First Claim