Methods of manufacturing structures having concealed components
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United States of America Patent
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Feb 20, 2018
Issued Date -
N/A
app pub date -
Oct 27, 2016
filing date -
Oct 30, 2015
priority date (Note) -
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Abstract
The disclosed embodiments include a method of integrating metal elements separated by gaps with a structure that conceals the metal elements and gaps. The method includes treating a metal substrate to a plasma electrolytic oxidation process to form a ceramic layer from a portion of the metal substrate, thereby providing the ceramic layer and an underlying metal portion of the metal substrate. The method further includes etching gap(s) in the underlying metal portion of the metal substrate to form metal elements separated by the gap(s), and backfilling the gap(s) with a non-conductive substance. As such, the metal elements, the non-conductive substance filling the gap(s), and the ceramic layer collectively form a structure whereby the ceramic layer at least partially conceals the metal elements and the gap(s).
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