Heat dissipating module

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United States of America Patent

PATENT NO 9897393
SERIAL NO

15166275

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Abstract

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The present invention relates to a heat dissipating module which comprises a first flat shell body and a plurality of second flat shell bodies. The first flat shell body has a first chamber and a first wick structure formed on an inner wall of the first chamber. Each of the second flat shell bodies defines a second chamber which is provided with a working fluid and a second wick structure therein. Each of the second flat shell bodies has a heat pipe plugged and connected to the first flat shell body. Therefore, the working fluid in each of the second chambers flows into the first chamber through the corresponding heat pipes to perform heat dissipation by liquid-vapor circulation.

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Patent Owner(s)

  • ASIA VITAL COMPONENTS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lan, Wen-Ji New Taipei, TW 40 131

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