Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium

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United States of America Patent

PATENT NO 9899211
SERIAL NO

14613926

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Abstract

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A method of manufacturing a semiconductor device, includes: forming a film on a substrate by performing a cycle a predetermined number of times, the cycle including: supplying a raw material gas to a substrate in a process chamber, exhausting the raw material gas remaining in the process chamber through an exhaust line, supplying an amine-based gas; and exhausting the amine-based gas through the exhaust line with the supply of the amine-based gas stopped. A degree of valve opening of an exhaust valve disposed in the exhaust line is changed in multiple steps in the process of exhausting the amine-based gas.

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Patent Owner(s)

  • HITACHI KOKUSAI ELECTRIC INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kirikihira, Kaori Toyama, JP 2 23
Orihashi, Yugo Toyama, JP 21 156
Shimamoto, Satoshi Toyama, JP 53 1739

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