Method for patterning a substrate involving directed self-assembly

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United States of America Patent

PATENT NO 9899220
SERIAL NO

15289550

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Abstract

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A method for patterning a substrate is disclosed. The method includes applying a first directed self-assembly (DSA) patterning process that defines a first patterned layer on top of the substrate. The pattern of the first patterned layer is to be transferred into the substrate. The method also includes applying a planarizing layer on top of the first patterned layer. The method further includes applying a second DSA patterning process that defines a second patterned layer on top of the planarizing layer, thereby not patterning the planarizing layer. A pattern of the second patterned layer is to be transferred into the substrate. Projections of the pattern of the second patterned layer and the pattern of the first patterned layer on the substrate have no overlap. Additionally, the method includes transferring the patterns defined by the first patterned layer and the second patterned layer into the substrate.

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Patent Owner(s)

Patent OwnerAddress
IMEC VZWKAPELDREEF 75 LEUVEN 3001
KATHOLIEKE UNIVERSITEIT LEUVEN KU LEUVEN R&DWAAISTRAAT 6 BOX 5105 LEUVEN 3000

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Boon Teik Leuven, BE 26 46
Doise, Jan Leuven, BE 4 1
Singh, Arjun Leuven, BE 48 374
Tao, Zheng Leuven, BE 14 9

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