Substrate for LED with total-internal reflection layer surrounding LED
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United States of America Patent
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Feb 20, 2018
Issued Date -
N/A
app pub date -
Oct 22, 2014
filing date -
Nov 7, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A packaged LED module includes an LED die mounted on a substrate surface. Formed on the substrate surface and surrounding the die is a first layer of a low index of refraction material. A lens of a higher index of refraction material is molded over the LED die and the first layer. The interface of the lens and the first layer reflects light by total internal reflection (TIR), in accordance with Snell's Law, when the LED light impinges at greater than the critical angle. The first layer may be a low index epoxy, silicone, or other material. In another embodiment, a layer surrounding the LED die is processed after the lens is formed to create an air/lens interface for TIR. The LED die may include a phosphor layer, which results in even more side light being reflected off the interface and not absorbed by the substrate surface.
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