Cooling device

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United States of America Patent

PATENT NO 9900973
SERIAL NO

14867465

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Abstract

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The object of the present invention is to provide a cooling device capable of more efficiently cooling heating components heated. The cooling device has a first heat sink and a heat conductor. The first heat sink is thermally coupled to a first heating component mounted on a first surface of a circuit board. The heat conductor is thermally coupled to a second heating component mounted on a second surface of the circuit board and is thermally coupled to the first heat sink.

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Patent Owner(s)

Patent OwnerAddress
IP WAVE PTE LTD20 COLLYER QUAY #23-01 COLLYER QUAY SINGAPORE 049319

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Matsumoto, Yuki Tokyo, JP 53 238

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