Integrated circuit package including floating package stiffener
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United States of America Patent
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Feb 20, 2018
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app pub date -
Dec 12, 2016
filing date -
Dec 12, 2016
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Abstract
Apparatus and method to provide integrated circuit (IC) package integrity without adverse performance degradation are disclosed herein. In some embodiments, an apparatus may include one or more integrated circuits (ICs); a metallic structure that encircles the one or more ICs without being in contact with the one or more ICs, wherein the metallic structure is without an electrical ground; and a conductive epoxy layer disposed below and in contact with the metallic structure, wherein the conductive epoxy is to reduce an electromagnetic field induced by the metallic structure in response to a presence of a wireless signal that operates at approximately a resonant frequency associated with the metallic structure.
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