Polyamide resin composition and molded product

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United States of America Patent

PATENT NO 9902843
APP PUB NO 20160222196A1
SERIAL NO

15021979

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Abstract

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A polyamide resin composition includes:

    (A) a polyamide resin;(B) an aluminic acid metal salt; and(C) at least one or more compounds selected from the group consisting of the following (C1) to (C3): (C1) a salt of one or more metal elements selected from the group consisting of groups 3, 4, 11, 13, and 14 of the periodic table,(C2) at least one organic heat stabilizer selected from the group consisting of a hindered phenol compound, a hindered amine compound, and an organic phosphorus compound, and(C3) a crystalline thermoplastic resin having a lower melting point than that of the component (A) and/or an amorphous thermoplastic resin having a lower Vicat softening point than that of the component (A), andwherein the content of the component (B) is 0.03 to 20 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (C3).

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Patent Owner(s)

Patent OwnerAddress
ASAHI KASEI CHEMICALS CORPORATION1-105 KANDA JINBOCHO CHIYODA-KU TOKYO 101-8101

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kawamura, Tomoyo Tokyo, JP 5 5
Okamoto, Masashi Tokyo, JP 96 535
Shikano, Yasukazu Tokyo, JP 13 29
Watanabe, Katsushi Tokyo, JP 39 890

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