Film material, electronic component using film material, and method for producing electronic component

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United States of America Patent

PATENT NO 9902880
SERIAL NO

14997130

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Abstract

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A film material includes a substrate and a film layer arranged on one main surface of the substrate. The film layer contains a fibrous first resin and a thermosetting second resin in an uncured or semi-cured state, and a linear expansion coefficient CF of the first resin is smaller than a linear expansion coefficient CR of the second resin in cured state.

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Patent Owner(s)

Patent OwnerAddress
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTDOSAKA-SHI OSAKA 540-6207

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Motomura, Koji Osaka, JP 30 134

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