Flow control valve and a mass flow controller using the same

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United States of America Patent

PATENT NO 9903497
SERIAL NO

15025061

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Importance

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Abstract

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A first thermal shield constituted by a material with a thermal conductivity of 20 W/(m·K) or less and a second thermal shield constituted by a space are disposed between a passage and a laminated piezoelectric actuator. Preferably, a third thermal shield with a thermal conductivity of 20 W/(m·K) or less is further disposed. Thereby, a flow control valve which can effectively intercept a transmission of heat using a simpler and compacter structure than a flow control valve according to a conventional technology so that the temperature of a laminated piezoelectric actuator does not exceed its heat-resistant temperature even when it is used for high-temperature process gas is provided.

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Patent Owner(s)

  • HITACHI METALS, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishii, Mamoru Mie-ken, JP 17 60
Sasaki, Ryu Mie-ken, JP 14 157

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