Wireless thermionic sensor package and methods of using
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United States of America Patent
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Feb 27, 2018
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app pub date -
Dec 18, 2014
filing date -
Dec 18, 2014
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Abstract
A thermionic sensor package and methods of using the same are disclosed. The sensor package includes a substrate, a package housing disposed on the substrate and at least partially defining a package chamber in which vacuum conditions are maintained, a thermionic sensor disposed in the package chamber, and a wireless transmission device disposed on the substrate. The thermionic sensor includes a sensor housing at least partially defining an emission chamber, a cathode disposed in the emission chamber, an anode disposed in the emission chamber and spaced apart from the cathode, and an electrically conductive layer disposed in the emission chamber facing the anode and cathode. The method includes generating a detection signal when the anode and the cathode of the sensor are at substantially the same temperature.
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