Universal direct docking at probe test
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United States of America Patent
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Feb 27, 2018
Issued Date -
N/A
app pub date -
Sep 14, 2015
filing date -
Mar 25, 2011
priority date (Note) -
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status (Latency Note)
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Abstract
Techniques are described to provide a universal direct docking tester to prober interface between the test head and a prober of semiconductor wafer prober for testing die within semiconductor wafers. In an implementation, a universal direct docking tester to prober interface includes a tray assembly configured to be mounted within an opening of the prober housing and a stiffener assembly configured to be mounted to a test head to support a load board PCB that includes a probe head. The stiffener assembly includes a skirt that is received in the tray assembly when the test head is interfaced with the prober to position the load board PCB within the prober to facilitate engagement of the probe head with the wafer.
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