Semiconductive resin composition and power transmission cable using same

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United States of America Patent

PATENT NO 9905326
SERIAL NO

14819873

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Abstract

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A semiconductive resin composition is composed of a base polymer including an ethylene-vinyl acetate copolymer with a vinyl acetate content of not lower than 60 percent by weight, two or more of fatty acid zinc, oleic acid bisamide and trimellitic acid ester, a peroxide-based crosslinking agent having a one hour half-life temperature of not lower than 130 degrees C., and a carbon having a DBP (dibutyl phthalate) adsorption capacity of not larger than 150 mg/g.

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Patent Owner(s)

  • HITACHI METALS, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kikuchi, Ryutaro Mito, JP 19 60
Setogawa, Akira Hitachi, JP 6 34

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