Metal conducting structure and wiring structure

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United States of America Patent

PATENT NO 9905327
SERIAL NO

14983484

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Abstract

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A metal conducting structure includes a first metal conducting layer, a second metal conducting layer, and a third metal conducting layer. The first metal conducting layer consists of a first polymer material and first metal particles. The first metal conducting layer is covered by the second metal conducting layer which is a structure with pores, the structure consists of second metal particles. The second metal conducting layer is covered by the third metal conducting layer. The pores of the second metal conducting layer are filled with a metal material of the third metal conducting layer.

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Patent Owner(s)

Patent OwnerAddress
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTENO 195 SEC 4 CHUNG HSING ROAD CHUTUNG HSINCHU 31040

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiang, Ying-Jung New Taipei, TW 5 2
Tsai, Yuan-Ling Changhua County, TW 5 0
Yu, Jiun-Jang Hsinchu, TW 11 93

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