Resistive element and method for manufacturing the same

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United States of America Patent

PATENT NO 9905340
SERIAL NO

15102711

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Abstract

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A method for manufacturing a chip resistive element including a substrate, a resistor formed on the substrate, and electrodes connected to opposite ends of the resistor, the method including an electrode forming step of forming the electrodes on the substrate. The electrode forming step includes a step of forming a first electrode layer on the substrate using a first electrode material containing silver, and a step of forming a second electrode layer on the first electrode layer using a second electrode material containing silver and palladium. The first electrode material has a higher silver content than the second electrode material.

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Patent Owner(s)

Patent OwnerAddress
KOA CORPORATION3672 ARAI INA-SHI NAGANO 396-0025

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koda, Sohei Nagano, JP 1 3
Takeue, Yuya Nagano, JP 2 6

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