Method of producing bonded body and method of producing power module substrate

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United States of America Patent

PATENT NO 9905437
SERIAL NO

14910110

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Abstract

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A method of producing a bonded body is disclosed in which a ceramic member made of ceramics and a Cu member made of Cu or a Cu alloy are bonded to each other, the method including: a laminating step of laminating the ceramic member and the Cu member in a state where a Cu—P-based brazing filler material containing 3 mass % to 10 mass % of P and an active metal material are interposed therebetween; and a heating step of heating the ceramic member and the Cu member which are laminated.

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Patent Owner(s)

  • MITSUBISHI MATERIALS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nagatomo, Yoshiyuki Saitama, JP 84 544
Terasaki, Nobuyuki Saitama, JP 62 212

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