Carrier base material-added wiring substrate
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United States of America Patent
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Feb 27, 2018
Issued Date -
N/A
app pub date -
Sep 25, 2017
filing date -
Sep 30, 2016
priority date (Note) -
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status (Latency Note)
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Abstract
A carrier base material-added wiring substrate includes a wiring substrate and first to third carrier base materials. The first carrier base material is adhered by a first adhesive layer to a lower surface of the wiring substrate and includes an opening that exposes a product area of the wiring substrate. The second carrier base material is arranged in the opening of the first carrier base material and contacts the lower surface of the wiring substrate. The third carrier base material is adhered by a second adhesive layer to the first carrier base material and the second carrier base material. The third carrier base material covers the opening of the first carrier base material. The second adhesive layer is formed entirely on an upper surface of the third carrier base material.
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