Sensor package structure
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United States of America Patent
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-
Feb 27, 2018
Issued Date -
N/A
app pub date -
Jul 12, 2017
filing date -
Jul 12, 2016
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A sensor package structure includes a substrate, a sensing member, a shielding member, a metallic wire, and an encapsulating compound. The substrate includes a die bonding zone and a wiring zone. The sensing member is mounted on the die bonding zone and includes a sensing zone, a carrying zone arranged around the sensing zone, and a connecting zone arranged outside of the carrying zone. The shielding member includes a translucent covering portion and a supporting portion connected to a peripheral portion of the covering portion. The supporting portion having a coefficient of thermal expansion less than 10 ppm/° C. is fixed on the carrying zone. The metallic wire connects the wiring zone and the connecting zone. The encapsulating compound is disposed on the wiring zone and covers a peripheral side of the sensing member, the connecting zone, and a peripheral side of the shielding member.
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