Super-junction structure and method for manufacturing the same and semiconductor device thereof
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United States of America Patent
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Feb 27, 2018
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app pub date -
Sep 1, 2015
filing date -
Sep 1, 2014
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Abstract
The present disclosure relates to a super-junction structure, a method for manufacturing the super-junction structure and a semiconductor device including the super-junction structure. The super-junction structure includes an epitaxy layer of a first doping type and a plurality of first pillar regions of a second doping type which are formed in the epitaxy layer and are separated from each other. Each of the first pillar regions has a doping concentration that decreases from bottom to top. A portion of the epitaxy layer between adjacent ones of the first pillar regions is a second pillar region. The first pillar regions and the second pillar region are arranged alternatively to form the super-junction structure. The first pillar regions are characterized by the doping concentration that decreases from bottom to top so that the super-junction structure has a relatively high breakdown voltage and a relatively low on resistance. Moreover, the super-junction structure changes a path of an avalanche current and thus suppresses an avalanche current so that the device is not easily damaged.
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