Composition for encapsulant and encapsulant and electronic device
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United States of America Patent
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Feb 27, 2018
Issued Date -
N/A
app pub date -
Mar 10, 2015
filing date -
Mar 11, 2014
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Provided are a composition for an encapsulant having a viscosity of about 4,000 to about 9,500 mPa·s when measured using a Brookfield (DV-II+pro) spindle No. 52 at a torque of about 90% under atmospheric pressure at about 23° C., whereby maintaining a phosphor precipitation degree within about 18% when including a phosphor and allowed to stand at about 23° C. for greater than or equal to about 2 hours, and including at least one first siloxane compound having a silicon-bonded hydrogen (Si—H) and at least one second siloxane compound having a silicon-bonded alkenyl group (Si-Vi), an encapsulant obtained by curing the composition, and an electronic device including the encapsulant.
First Claim
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International Classification(s)
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B82Y:SPECIFIC USES OR APPLICATIONS OF NANO-STRUCTURES; ....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
- H01B:CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATER....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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