Solderless module connector for a hearing assistance device assembly
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United States of America Patent
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Feb 27, 2018
Grant Date -
Aug 13, 2015
app pub date -
Apr 22, 2015
filing date -
Nov 27, 2013
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Disclosed herein, among other things, are systems and methods for solderless module connectors for hearing assistance devices. One aspect of the present subject matter includes a method of assembling a hearing assistance device. According to various embodiments, the method includes providing a structure including a laser-direct structuring (LDS) portion, and inserting a flexible universal circuit module (UCM) having conductive surface traces into the structure. The UCM is electrically connected to the LDS portion using direct compression without the use of wires or solder, according to various embodiments.
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Family
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