Multi-layer wiring board and method of manufacturing the same
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United States of America Patent
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Feb 27, 2018
Issued Date -
N/A
app pub date -
Apr 21, 2014
filing date -
Apr 22, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A multi-layer wiring board is configured having stacked therein, in a stacking direction, via an adhesive layer, a plurality of printed wiring bases in each of which a wiring pattern and a via are formed on/in a resin base. A multi-layer wiring board includes a movable portion configured from an elastic member and a void portion, the movable portion being formed in the printed wiring bases and adhesive layer in a periphery of a matrix-shaped plurality of multi-layer wiring portions disposed at a certain interval as viewed in a planar manner, and the movable portion joining the plurality of multi-layer wiring portions such that each of the multi-layer wiring portions is displaceable in the stacking direction and a direction of surfaces of the printed wiring bases.
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Cited Art Landscape
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