Passive thermal system providing an embedded interface for heat pipes
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United States of America Patent
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Mar 6, 2018
Issued Date -
N/A
app pub date -
Aug 5, 2015
filing date -
Aug 5, 2015
priority date (Note) -
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Abstract
A passive thermal system for use in aerospace vehicles includes a first passive thermal panel having at least one internal resident heat pipe, wherein the first passive thermal panel is further configured to provide an embedded interface between a portion of the resident heat pipe and at least one heat pipe extending from a neighboring passive thermal panel. The embedded interface is facilitated via an internal channel that is adjacent to the internal resident heat pipe. The channel is dimensioned and arranged to receive a portion of a heat pipe extending from a passive thermal panel that will be situated adjacent to the first passive thermal panel. The embedded interface is also facilitated by an arrangement that imparts a compressive force to the non-resident heat pipe that urges it against the resident heat pipe.
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