Inertial and pressure sensors on single chip
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United States of America Patent
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Mar 6, 2018
Issued Date -
N/A
app pub date -
Oct 2, 2014
filing date -
Oct 3, 2013
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
In accordance with one embodiment, a single chip combination inertial and pressure sensor device includes a substrate, an inertial sensor including a movable sensing structure movably supported above the substrate, and a first fixed electrode positioned adjacent to the movable sensing structure, and a pressure sensor including a gap formed in the sensor at a location directly above the movable sensing structure, and a flexible membrane formed in a cap layer of the device, the flexible membrane defining a boundary of the gap and configured to flex toward and away from the gap in response to a variation in pressure above the flexible membrane.
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International Classification(s)
- G01L:MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL ....
- B81B:MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-ME....
- G01P:MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, D....
- G01C:MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING....
- B61B:RAILWAY SYSTEMS; EQUIPMENT THEREFOR NOT OTHERWISE ....
- G01D:MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VAR....
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